MediaTek just announced it’s latest top-end processors with built-in 5G the Dimensity 1200 and Dimensity 1100. These SoC are the company’s first mobile chips to use TSMC’s 6nm process technology. The Dimensity 1200 comes with an octa-core CPU designed where an ultra-core Arm Cortex-A78 clocked that runs up to 3GHz for extreme performance along with three Arm Cortex-A78 super cores clocked up to 2.6GHz and four Arm Cortex-A55 efficiency cores clocked at 2GHz.
The performance of the CPU is up to 22% faster and 25% more power-efficiency as compared to the previous generation. It has a nine-core Mali-G77 GPU that increases by 13% in performance and a six-core MediaTek APU 3.0.
The Dimensity 1100 SoC comes with an octa-core CPU designed where four Arm Cortex-A78 clocked that run up to 2.6GHz along with four Arm Cortex-A55 efficiency cores clocked at 2GHz and has same nine-core Arm Mali-G77 GPU and six-core MediaTek APU 3.0.
The Dimensity 1200 supports up to ultra-fast 168Hz refresh rates and the Dimensity 1100 supports 144Hz refresh rates and both have featured MediaTek’s HyperEngine 3.0 gaming technologies, which includes 5G call and data concurrency for more reliable connectivity, plus multi-touch boost touchscreen responsiveness. The new chipsets also support ray tracing in mobile games and artificial reality applications for more realistic visuals, along with super hotspot power savings which let users go longer in between charges.
Both support 5G standalone and non-standalone architectures with True Dual SIM 5G (5G SA + 5G SA). The Dimensity 1200 SoC supports 200MP photos, has five-core HDR-ISP, 4K HDR video capture, while the Dimensity 1100 SoC can supports a 108MP camera. Both chipsets support AI camera features including AI-Panorama Night Shot, AI Multi-Person Bokeh, AI noise reduction (AINR), and HDR capabilities. The chipsets also support new AI-enhanced video playback that comes with AI SDR-to-HDR.
Both SoC has Bluetooth 5.2, supports ultra-low latency true wireless stereo audio, and LC3 encoding for higher quality, lower latency streaming audio. The Dimensity 1200 has received TÜV Rheinland certification for its 5G performance, with tests covering 72 real-world scenarios.
MediaTek Dimensity 1200 and 1100 SoC Specifications and Features -
|Dimensity 1200||Dimensity 1100|
|Process||5nm TSMC||5nm TSMC|
|CPU||1x Cortex-A78 @ 3GHz, 3x Cortex-A78 @ 2.6GHz, 4x Cortex-A55 @ 2GHz||4x Cortex-A78 @ 2.6GHz, 4x Cortex-A55 @ 2GHz|
|Memory||2X LPDDR4x, up to 16GB, dual-channel UFS 3.1||2X LPDDR4x, up to 16GB, dual-channel UFS 3.1|
|Camera||32MP+16MP, 200MP, Multi-camera, HDR-ISP (3+2) / Video HDR / Video NR / Video Bokeh / Video EIS / AI-Shutter / AI-AE / AI-AF / AI-AWB / AI-NR HDR / AI-HDR / AI-FD||32MP+16MP, 108MP, Multi-Camera, HDR-ISP (3+2) / Video HDR / Video NR / Video Bokeh / Video EIS / AI-Shutter / AI-AE / AI-AF / AI-AWB / AI-NR HDR / AI-HDR / AI-FD|
|Graphics||Mali-G77 MC9||Mali-G77 MC9|
|Display||2520 x 1080 (Full HD+) at 21:9 168Hz, QHD+ at 90Hz||2520 x 1080 (Full HD+) at 21:9 144Hz, QHD+ at 90Hz|
|Video||H.264, H.265 / HEVC, VP-9, AV1 / H.264, H.265 / HEVC||H.264, H.265 / HEVC, VP-9, AV1 / H.264, H.265 / HEVC|
|Modem||True Dual 5G SIM (5G SA + 5G SA) modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD Band, NR FDD Band, DSS, NR DL 2CC, 200 MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, 2×2 MIMO, 256QAM VoNR / EPS fallback||True Dual 5G SIM (5G SA + 5G SA) modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD Band, NR FDD Band, DSS, NR DL 2CC, 200 MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, 2×2 MIMO, 256QAM VoNR / EPS fallback|
|Connectivity||Integrated Wi-Fi 6 (a/b/g/n/ac/ax), Bluetooth 5.2, GPS L1CA+L5 / BeiDou B1I+ B2a / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC, FM Radio||Integrated Wi-Fi 6 (a/b/g/n/ac/ax), Bluetooth 5.2, GPS L1CA+L5 / BeiDou B1I+ B2a / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC, FM Radio|
After the announcement of the chipsets, Realme confirmed that its latest smartphone Realme X9 pro will be the first device to be powered by the new MediaTek Dimensity 1200 SoC and expected to roll out in the mid of Q1 this year. MediaTek partnered with Xiaomi, Vivo, OPPO, and realme to use the chips in their phones in the mid of Q1 and Q2 this year, and the ARM, China Mobile, Tetras.AI, ArcSoft, and Tencent Games are other partners.