MediaTek Dimensity 9000 4nm SoC launched with world’s first Cortex-X2 CPU, up to 320MP camera, LPDDR5X RAM, Bluetooth 5.3

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MediaTek Dimensity 9000 launch

MediaTek has announced its latest high-end flagship processor the Dimensity 9000 SoC, after rumors. It is the world’s first chip based on TSMC’s 4nm process tech. It is also the first chip that uses the latest ARM Cortex-X2, A710, and A510 CPUs based on Armv9 architecture, and comes with the Mali-G710 GPU. This chip is also the world’s first to support LPDDR5X RAM that supports up to 7500Mbps, and it is also the first to support Bluetooth 5.3 connectivity.

MediaTek Dimensity 9000 features

MediaTek says that this Chip will offer over 35% performance leap over current-generation Android Flagship chips that could be Snapdragon 888 SoC, and also said that this will offer over 37% better efficiency. It has a 1 x ARM Cortex-X2 CPU clocked at 3.05GHz, 3x Cortex-A710 CPU clocked at 2.85GHz and the 4 x Cortex-A510 CPU cores are clocked at 1.8GHz.

MediaTek Dimensity 9000 GeekBench Score

It also said that the SPECint2006 benchmark score is 35% more than the Android Flagship chip, while GeekBench 5 is 10.5% more than the competition. The multicore performance exceeds current Android competition, will be on par with Apple’s A15 Bionic, according to the company.

It has the latest Arm Mali-G710 10-core GPU that gives 35% better performance and 60% better power efficiency compared to current Android flagships Chip. It also supports Ray Tracing capability on Vulkan through a software API.

MediaTek Dimensity 9000 GPU Mali G710

It comes with a 5th gen AI processing unit (APU) which is 4 times more power-efficient than its last generation and will power various AI experiences in multimedia, gaming, camera, and social video experiences. In the ETHZ Ai Benchmark, it outperforms Google Pixel 6 and the Tensor SoC, according to MediaTek.

MediaTek Dimensity 9000 details

MediaTek Dimensity 9000 Features -

4nm TSMC
1x Cortex-X2 @ 3.05GHz 1x1024KB pL2, 3x Cortex-A710 @ 2.85GHz 3x512KB pL2, 4x Cortex-A510 @ 1.80GHz 4x256KB pL2, 8MB sL3
Mali-G710MP10 @ ~850MHz
4x 16-bit CH @ 3200MHz LPDDR5   /  51.2GB/s and @ 3750MHz LPDDR5X / 60.0GB/s, 6MB System Cache
Imagiq790 New-gen Triple 18-bit ISP 9GPix/s processing throughput, Single Sensor up to 320MP, Triple Sensor 32+32+32MP
180Hz FullHD+ display support
H.265/HEVC, H.264, VP9, 8K30 AV1 Decode, 8K30 & 4K120 encode & 8K60 decode
LTE Category 24/18, 5G NR Sub-6
Bluetooth 5.3 support, Wi-Fi 6E 2x2 (BW160), Beidou III-B1C GNSS support

MediaTek Dimensity 9000 SoC will be powered devices are expected around in the first quarter of 2022, might be introduced first in the Xiaomi phones.