MediaTek has officially launched its latest processors, the Dimensity 9500s and Dimensity 8500 chipsets in India at its Tech Day event in Delhi, following their global debut last month. Aimed at flagship and premium smartphones, the new platforms emphasize high performance, power efficiency, on-device AI capabilities, advanced imaging, gaming enhancements, and next-generation wireless connectivity. Both processors adopt an “All-Big Core” CPU design and are optimized for agentic AI workloads.
MediaTek Dimensity 9500s -
Manufactured using a 3nm process, the Dimensity 9500s features an octa-core All-Big Core CPU configuration. It comprises one Cortex-X925 ultra core clocked at up to 3.73GHz, three Cortex-X4 high-performance cores, and four Cortex-A720 performance cores. The Immortalis-G925 GPU handles graphics duties, while the integrated NPU enables support for generative reasoning and multi-modal AI models.
Key features include -
- MediaTek Imagiq ISP with support for 8K full-focus Dolby Vision HDR video recording and real-time motion tracking at 30fps
- Adaptive Game Technology 3.0 (MAGT 3.0) and Frame Technology 3.0 (MFRC 3.0) for improved gaming efficiency
- 5G Release-17 modem with 4CC carrier aggregation and peak download speeds of up to 7Gbps
- MediaTek 5G UltraSave 4.0 power-saving technology
- AI Network Suite 2.0 for consistent performance in low-signal environments
- MediaTek Xtra Range 3.0 to enhance indoor Wi-Fi coverage
- Phone-to-phone Bluetooth direct connectivity with a range of up to five kilometres
MediaTek Dimensity 9500s Specifications -
| CPU | Octa-core (1x Cortex-X925 up to 3.73GHz, 3x Cortex-X4, 4x Cortex-A720), 12MB L3 cache, 10MB SLC |
| Memory | LPDDR5X, up to 10667 Mbps |
| Storage | UFS 4 + MCQ |
| 5G / 4G | Multi-mode 5G/4G/3G/2G, SA & NSA, 5G carrier aggregation |
| 5G Downlink | Sub6 DL 4CC 300MHz, R17 Enhancement, LB DL 4×4 MIMO |
| 5G Uplink | Sub6 UL 2CC 200MHz, R17 Enhancement, FDD UL 2×2 MIMO / PC2 |
| Power Saving | MediaTek UltraSave 4.0, R17 Power Saving Enhancement |
| GNSS | GPS, BeiDou, Glonass, Galileo, QZSS, NavIC L5 |
| Wi-Fi | Wi-Fi 7 (a/b/g/n/ac/ax/be), Triple Band Triple Concurrency, peak 6.5 Gbps |
| Bluetooth | Bluetooth 5.4 |
| Camera | Max sensor 320MP, 108MP @ 30fps, 3x 36MP @ 30fps; Max video 8K60 |
| GPU | Arm Immortalis-G925 |
| Video |
8K60 10-bit decode (HEVC / AVC / VP9 / AV1), 8K30 10-bit encode (HEVC / AVC), 8K60 8-bit HEVC encode |
| Display | WQHD+ up to 180Hz, Tri-port MIPI for Tri-Fold displays |
| AI | MediaTek NPU supporting Generative AI and Agentic AI |
MediaTek Dimensity 8500 -
Built on a 4nm manufacturing process, the Dimensity 8500 features an All-Big Core CPU design with eight Cortex-A725 cores, clocked at up to 3.4GHz. Its computing and gaming engine is optimized to deliver consistent frame rates, faster load times, improved power efficiency, and ray-tracing support for mainstream mobile games.
Key features include -
- MediaTek’s 8th-generation NPU with support for mainstream large language models, multi-modal AI, and on-device image generation
- AI ultra-clear telephoto algorithm for enhanced image processing
- Dimensity AI semantic engine for intelligent frame optimization
- Mali-G720 GPU offering up to 25% higher performance compared to the previous generation
- Precise workload scheduling for balanced performance and efficiency
- Support for LPDDR5X memory with speeds of up to 9600Mbps
MediaTek Dimensity 8500 Specifications -
| CPU | Octa-core (1x Cortex-A725 up to 3.4GHz, 3x Cortex-A725 up to 3.2GHz, 4x Cortex-A725 up to 2.2GHz), 6MB L3 cache, 5MB SLC |
| Memory | LPDDR5X 4-channel, up to 9600 Mbps |
| Storage | UFS 4 + MCQ |
| 5G / 4G | Multi-mode 5G/4G/3G/2G, SA & NSA modes, 5G carrier aggregation |
| Smart Network | Smart Network Suite 3.0, Subway Mode 2.0, DSDA 2.0 |
| 5G Downlink | FR1 LB DL 4×4 MIMO, 3CC up to 220 MHz |
| 5G Uplink | 256QAM FR1 UL 2CC, FDD UL TxD |
| Power Saving | MediaTek UltraSave 3.0+, R16 UL Enhancement |
| GNSS | GPS, BeiDou, Glonass, Galileo, QZSS, NavIC L5 |
| Wi-Fi | Wi-Fi 6E (a/b/g/n/ac/ax), 2T2R |
| Bluetooth | Bluetooth 5.4 |
| Camera | Max sensor 320MP, 3x 32MP @ 30fps; Max video 4K60 |
| GPU | Arm Mali-G720 MC8 |
| Video Encode / Playback | 4K @ 60FPS (H.264 / AVC, H.265 / HEVC, VP9, AV1) |
| Display | WQHD+ up to 144Hz, dual screen support (dual DSI) |
| AI | MediaTek NPU 880 |
Availability -
MediaTek has confirmed that smartphones featuring the Dimensity 9500s and Dimensity 8500 will be launched via its partner brands. In India, the OPPO Find X9s is officially confirmed to be powered by the chipset. POCO has also announced that it will introduce a Dimensity-based device in the Indian market soon, with more launches from other OEMs expected over the coming months.
Addressing the launch, JC Hsu, Corporate Senior Vice President at MediaTek and General Manager of the Wireless Communications Business Unit, stated:
As leaders in smartphone global share, we are committed to expanding our investment in advanced technologies and striving to make bleeding-edge products available to more people. This mission is evident in this pair of Dimensity chipsets, which are intended to provide more flagship and premium smartphone experiences while upholding our vision in bringing the best possible performance and power efficiency to more people.
