MediaTek Unveils Official Dimensity 8300 4nm 2nd-Gen SoC; Confirms Dimensity 8300-Ultra for Redmi K70E

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MediaTek Dimensity 8300 launch Redmi K70.

MediaTek has recently introduced the Dimensity 8300, the latest addition to its premium 8000 series SoC lineup designed for cutting-edge 5G smartphones. Serving as the successor to the Dimensity 8200, this new processor utilizes the second-generation 4nm process technology from TSMC.

CPU and GPU -

MediaTek Dimensity 8300 CPU GPU specs.

The Octa-Core processor boasts 4 x Cortex-A715 performance cores with a peak frequency of 3.35GHz and 4 x Cortex-A510 energy efficiency cores reaching a maximum frequency of 2.2GHz. According to the company, this configuration delivers a 20% improvement in performance compared to the previous generation, coupled with a 30% reduction in power consumption.

The 6-core Mali-G615 GPU integrated into the Dimensity 8300 promises a remarkable 60% increase in peak performance while concurrently reducing power consumption by 55% compared to its predecessor.


Setting a milestone in its category, the Dimensity 8300 features the APU 780 AI processor, facilitating comprehensive generative AI support. This integration empowers developers to create innovative applications utilizing large language models (LLMs) of up to 10B, ensuring stable diffusion.

The APU 780 shares the same architecture as the flagship Dimensity 9300 SoC, resulting in a twofold improvement in INT and FP16 computation and a notable 3.3x boost in AI performance compared to the Dimensity 8200.


Equipped with MediaTek's 14-bit HDR-ISP Imagiq 980, the Dimensity 8300 promises sharper and clearer 4K60 HDR videos, with an extended recording capability due to its highly power-efficient design.

The HyperEngine adaptive game technology enhances power savings during gameplay, intelligently adapting to computing demands and monitoring device temperature to optimize performance. This ensures users can experience full FPS, low lag, and seamless rendering.

Connectivity -

The Dimensity 8300 supports ultra-fast speeds through its built-in 3GPP Release-16 standard 5G modem, enabling 3CC carrier aggregation with up to 5.17Gbps downlink speeds.

MediaTek Dimensity 8200 specifications -

CPU4 x Arm Cortex-A715 cores up to 3.35GHz + 4 x Cortex-A510 cores at up to 2.2GHz, 4MB L3 + SLC cache
ProcessTSMC’s second-generation 4nm process
RAM/StorageSupports LPDDR5X memory up to 8533Mbps,UFS 4 + MCQ
GPUArm Mali-G615 MC6 GPU, MediaTek APU 780 (Generative AI), Up to 10 billion parameters, 8x faster transformer-based generative AI, 2x faster integer and floating-point compute improvement, 3.3x AI performance (AI Benchmark v5)
SensorsSecure Processor, HWRoT, Arm Memory Tagging Extension (MTE) Technology, CC EAL4+ Capable, FIPS 140-3, China DRM
CameraUp to 320MP camera, Imagiq 980 14-bit HDR-ISP
Display120Hz WQHD+ / 180Hz Full HD+ display support, HDR10+ Adaptive support
Network2G-5G Multi-Mode, 5G/4G CA, 5G/4G FDD+TDD, CDMA2000 1x/EVDO Rev. A (SRLTE), EDGE, GSM, TD-SCDMA, WCDMA
Multi-SIMSA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD and FDD bands, DSS, NR DL 3CC, 220MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, R16 UL Enhancement, 2×2 MIMO, 256QAM VoNR / EPS fallback
  • Wi-Fi 6E (a/b/g/n/ac/ax) ready, 2T2R, Bluetooth 5.4
  • GPS L1CA+L5 + L1C, BeiDou B1I+ B2a + B1C, Glonass L1OF, Galileo E1 + E5a, QZSS L1CA+ L5, NavIC

Availability -

MediaTek has announced that the Dimensity 8300 SoC will be the driving force behind 5G devices set to hit the global market by the conclusion of 2023.

Redmi K70E with Dimensity 8300-Ultra -

Redmi K70E with Dimensity 8300 Ultra Antutu score.

Today, Xiaomi has officially confirmed that the upcoming Redmi K70E, scheduled for launch later this month, will be powered by the Dimensity 8300-Ultra SoC, another custom chip tailored for Xiaomi. Additionally, Xiaomi disclosed that the phone has achieved an impressive score of over 1.52 million points on AnTuTu 10.

Earlier this year, Xiaomi introduced the Xiaomi Civi3 and Redmi Note 12T Pro featuring the Dimensity 8200-Ultra, a custom chip designed for Xiaomi.

Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business Unit, remarked: "With MediaTek’s optimized Dimensity 8000 series, consumers no longer need to compromise between accessibility and premium experiences such as flagship-grade memory or accelerated AI capabilities—they can enjoy it all. The Dimensity 8300 unlocks new possibilities for the premium smartphone segment, providing users with in-hand AI, hyper-realistic entertainment opportunities, and seamless connectivity, all without sacrificing efficiency."