Realme X50 5G to be announced on January 7 with dual punch-hole display, Snapdragon 765G, liquid Cooling, VOOC 4.0.

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Realme has confirmed that it launching the Realme X50 5G that will be introduced at an event in China on January 7. This is the Realme first 5G Smartphone.

China CMO Xu Qi Chase has posted an image of the Realme X50 smartphone that has a similar quad-camera arrangement as the Realme XT. This time it will come in a new polar color with new graphics.

It also confirmed that the phone should come with a Snapdragon 765G processor with a built-in 5G modem, which is the fastest processor in a mid-range smartphone. It also comes with a dual punch-hole display.

The company using the liquid-cooled copper tube for heat dissipation 3.0 gives five-dimensional heat dissipation that covers all the 100% heat sources. It will feature by VOOC flash charge 4.0 that support fast charging to charge your phone from 0 to 70% in 30 minutes. It also comes with an in-display fingerprint sensor.

According to rumors, it is the first company smartphone that could come with a 108 MP quad rear camera setup along with a 13 MP telephoto sensor with 5x optical zoom, 8 MP Ultra-wide sensor, and 2 MP depth sensor camera. On the front side, it has a dual punch-hole camera where the first camera could be 16 MP and the second camera is a portrait sensor.

There is no more information about the device; we should know more details about the phone in the coming days.

Source 1, 2