MediaTek has announced its new flagship processor MediaTek Dimensity 1000+ chip for the Indian market, and it expects the launch in early 2021. It will likely be the realme X7 5G that could be launched next month in India. The company already announced its latest mid-range 5G Dimensity 800U processor in India earlier this month, and the first phone powered by the 800U processor will be launched in January 2021.
The MediaTek Dimensity 1000+ 7nm chip comes with dual 5G SIM, carrier aggregation (2CC 5G-CA), integrated the latest Wi-Fi 6 and Bluetooth 5.1+ standards, MediaTek AI Processing Unit with APU 3.0 that offers more than double the performance of the previous generation APU, and it also supports highest 144Hz refresh rate display. This SoC also has MediaTek’s 5G UltraSave power-saving technology that improves battery life.
MediaTek Dimensity 1000+ SoC Features -
| Intelligent 5G Connectivity | MediaTek’s proprietary 5G UltraSave offers advanced power-saving technologies to improve battery life. The built-in technology intelligently manages a device’s 5G connection so you can do more and charge your device less often ensuring seamless connectivity. |
| Powerful Display Optimization | MediaTek MiraVision brings enhanced display technologies such as resolution upscaling, enhanced HDR10+ playback, and AI Picture Quality to make every screen look and feel premium. |
| Triple-A Gaming Performance | MediaTek HyperEngine game technology provides a more fluid, responsive, and reliable gaming experience with graphics to match, all on 120Hz gamer-ready displays. |
| Advanced and Adaptable Camera Support | Flagship-class, HDR-native ISP supports up to quad-camera sensors and up to 64MP sensors. |
We should know more information about the phones which are powered by Dimensity 1000+ SoC in India in the coming weeks.
